Temperature compensation of voltages of unselected word lines in non-volatile memory based on word line position

ABSTRACT

Reading and verify operations are performed on non-volatile storage elements using temperature-compensated read voltages for unselected word lines, and/or for select gates such as drain or source side select gates of a NAND string. In one approach, while a read or verify voltage is applied to a selected word line, temperature-compensated read voltages are applied to unselected word lines and select gates. Word lines which directly neighbor the selected word line can receive a voltage which is not temperature compensated, or which is temperature-compensated to a reduced degree. The read or verify voltage applied to the selected word line can also be temperature-compensated. The temperature compensation may also account for word line position.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a divisional of U.S. patent application Ser. No.11/424,800, titled “Method For Operating Non-Volatile Memory UsingTemperature Compensation Of Voltages Of Unselected Word Lines And SelectGates”, filed Jun. 16, 2006, (atty docket no.: SAND-01105US0),incorporated herein by reference.

This application is related to U.S. patent application Ser. No.11/424,812, titled “System For Operating Non-Volatile Memory UsingTemperature Compensation Of Voltages Of Unselected Word Lines And SelectGates”, filed Jun. 16, 2006, (atty docket no.: SAND-01105US1),incorporated herein by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to technology for non-volatile memory.

2. Description of the Related Art

Semiconductor memory has become more popular for use in variouselectronic devices. For example, non-volatile semiconductor memory isused in cellular telephones, digital cameras, personal digitalassistants, mobile computing devices, non-mobile computing devices andother devices. Electrical Erasable Programmable Read Only Memory(EEPROM) and flash memory are among the most popular non-volatilesemiconductor memories.

Both EEPROM and flash memory utilize a floating gate that is positionedabove and insulated from a channel region in a semiconductor substrate.The floating gate is positioned between the source and drain regions. Acontrol gate is provided over and insulated from the floating gate. Thethreshold voltage of the transistor is controlled by the amount ofcharge that is retained on the floating gate. That is, the minimumamount of voltage that must be applied to the control gate before thetransistor is turned on to permit conduction between its source anddrain is controlled by the level of charge on the floating gate.

When programming an EEPROM or flash memory device, such as a NAND flashmemory device, typically a program voltage is applied to the controlgate and the bit line is grounded. Electrons from the channel areinjected into the floating gate. When electrons accumulate in thefloating gate, the floating gate becomes negatively charged and thethreshold voltage of the storage element is raised so that the storageelement is in a programmed state. More information about programming canbe found in U.S. Pat. No. 6,859,397, titled “Source Side Self BoostingTechnique for Non-Volatile Memory;” and in U.S. Pat. No. 6,917,542,titled “Detecting Over Programmed Memory;” both patents are incorporatedherein by reference in their entirety.

Some EEPROM and flash memory devices have a floating gate that is usedto store two ranges of charges and, therefore, the storage element canbe programmed/erased between two states (an erased state and aprogrammed state). Such a flash memory device is sometimes referred toas a binary flash memory device.

A multi-state flash memory device is implemented by identifying multipledistinct allowed/valid programmed threshold voltage ranges separated byforbidden ranges. Each distinct threshold voltage range corresponds to apredetermined value for the set of data bits encoded in the memorydevice.

In present non-volatile storage devices, such as NAND flash memorydevices, temperature variations present various issues in reading andwriting data. A memory device is subject to varying temperatures basedon the environment in which it is located. For example, some currentmemory devices are rated for use between −40° C. and +85° C. Devices inindustrial, military and even consumer applications may experiencesignificant temperature variations. Temperature affects many transistorparameters, the dominant among which is the threshold voltage. Inparticular, temperature variations can cause read errors and widen thethreshold voltage distributions of the different states of anon-volatile storage element. Currently, temperature variations arecompensated for by changing the read/verify voltages applied to aselected word line in a way which accounts for the temperature variationof a selected storage element's threshold voltage. This approach can, atbest, address the average shift in the distribution of thresholdvoltages of a storage element which, for simplicity, are all assumed tobe in the same data state. However, an improved technique is needed forfurther reducing the spread of each state's threshold voltagedistribution resulting from changes in temperature.

SUMMARY OF THE INVENTION

The present invention addresses the above and other issues by providinga system and method for operating non-volatile storage in whichtemperature-compensated voltages are applied to unselected non-volatilestorage elements and/or select gates. Various benefits are achieved,including improved read and write performance.

In one embodiment, non-volatile storage is operated by applying a firstvoltage, such as a read or verify voltage, to a selected word line todetermine a programming condition of a first non-volatile storageelement which is associated with the selected word line. The firstnon-volatile storage element is provided in a set of non-volatilestorage elements. For instance, the first voltage can be a read voltagefor reading the programming state of first non-volatile storage elementafter it has been programmed. Or, the first voltage can be a verifyvoltage for verifying whether the first non-volatile storage element hasa reached a desired programming state. Such a verify voltage can beapplied between individual programming pulses in a series of suchpulses, for instance. Also, a temperature-compensated voltage is appliedto one or more unselected word lines that are associated with the set ofnon-volatile storage elements, while the first voltage is applied.

In one approach, the same temperature-compensated voltage is applied toeach of the unselected word lines. In another approach, differenttemperature-compensated voltages are applied to different unselectedword lines. In yet another approach, one or both unselected word lineswhich are direct neighbors of the selected word line receive either avoltage which is not temperature-compensated, or istemperature-compensated by a reduced amount relative to thetemperature-compensated voltage applied to the other unselected wordlines. A temperature-compensated voltage can also be applied to sourceand/or drain select gates, such as when the selected non-volatilestorage element is in a NAND string. The first voltage can betemperature-compensated as well.

In another embodiment, non-volatile storage is operated by applying afirst voltage to a selected word line to determine a programmingcondition of a first non-volatile storage element which is associatedwith the selected word line. The first non-volatile storage element isprovided in a set of non-volatile storage elements. Additionally, thefirst voltage is temperature-compensated according to a relativeposition of the selected word line among a plurality of word lines whichare associated with the set of non-volatile storage elements. Forexample, a greater magnitude of temperature compensation can be usedwhen the selected word line is closer to a drain than to a source of ablock which includes the plurality of word lines.

In another embodiment, non-volatile storage is operated by applying afirst voltage to a selected word line to determine a programmingcondition of a first non-volatile storage element which is associatedwith the selected word line, where the first non-volatile storageelement is provided in a set of non-volatile storage elements. Atemperature-compensated voltage is applied to least a first unselectedword line which is associated with the set of non-volatile storageelements, while the first voltage is applied. Additionally, a voltagewhich is not temperature-compensated, or is temperature-compensated by areduced amount relative to the temperature-compensated voltage appliedto the first unselected word line, is applied to at least a secondunselected word line which is associated with the set of non-volatilestorage elements, while the first voltage is applied. In one approach,the at least a first unselected word line is not a direct neighbor ofthe selected word line, while the at least a second unselected word lineis a direct neighbor of the selected word line.

In yet another embodiment, non-volatile storage is operated by applyinga first voltage to a selected word line to determine a programmingcondition of a first non-volatile storage element which is associatedwith the selected word line, where the first non-volatile storageelement is provided in a set of non-volatile storage elements. A firsttemperature-compensated voltage is applied to a select gate associatedwith first non-volatile storage element, while the first voltage isapplied, when the first non-volatile storage element is not a directneighbor of the select gate. A voltage which is nottemperature-compensated, or is temperature-compensated by a reducedamount relative to the first temperature-compensated voltage, is appliedto the select gate, while the first voltage is applied, when the firstnon-volatile storage element is a direct neighbor of the select gate.The select gate and the first non-volatile storage element can beprovided in a NAND string, where the select gate is at a source or drainside of the NAND string.

Corresponding methods for operating non-volatile storage andnon-volatile storage systems are provided. The non-volatile storagesystems include a set of non-volatile storage elements, and one or morecircuits for operating the set of non-volatile storage elements asdiscussed herein.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a top view of a NAND string.

FIG. 2 is an equivalent circuit diagram of the NAND string.

FIG. 3 is a cross-sectional view of the NAND string.

FIG. 4 is a block diagram of an array of NAND flash storage elements.

FIG. 5 is a block diagram of a non-volatile memory system.

FIG. 6 is a block diagram of a non-volatile memory system.

FIG. 7 is a block diagram depicting one embodiment of a sense block.

FIG. 8 illustrates an example of an organization of a memory array intoblocks for an all bit line memory architecture.

FIG. 9 illustrates an example of an organization of a memory array intoblocks for an odd-even memory architecture.

FIG. 10 depicts an example set of threshold voltage distributions.

FIG. 11 depicts an example set of threshold voltage distributions.

FIGS. 12A-C show various threshold voltage distributions and describe aprocess for programming non-volatile memory.

FIG. 13 is an example waveform applied to the control gates ofnon-volatile storage elements during programming.

FIG. 14 illustrates a threshold voltage change with temperature and wordline position.

FIG. 15 a is a timing diagram that explains the behavior of certainwaveforms during read/verify operations, where temperature-compensatedvoltages are applied to all unselected word lines and to both selectgates.

FIG. 15 b depicts the timing diagram of FIG. 15 a in which differenttemperature-compensated voltages are applied to the selected word linebased on word line position.

FIG. 16 is a timing diagram that explains the behavior of certainwaveforms during read/verify operations, where temperature-compensatedvoltages are applied to all unselected word lines, except the word linesdirectly neighboring a selected word line, and to both select gates.

FIG. 17 is a timing diagram that explains the behavior of certainwaveforms during read/verify operations, where the selected word linedirectly neighbors a source side select gate.

FIG. 18 is a timing diagram that explains the behavior of certainwaveforms during read/verify operations, where the selected word linedirectly neighbors a drain side select gate.

FIG. 19 is a flow chart describing one embodiment of a process forprogramming non-volatile memory.

DETAILED DESCRIPTION

The present invention provides a system and method for operatingnon-volatile storage in a manner which improves read and writeperformance. Improved performance is achieved by applyingtemperature-compensated voltages to unselected non-volatile storageelements and/or select gates. Specific benefits can include reduced readdisturbs, reduced margins between programmed states, improved writeperformance due to the use of larger programming step size, and/orreduced operating window by packing states closer together.

One example of a memory system suitable for implementing the presentinvention uses the NAND flash memory structure, which includes arrangingmultiple transistors in series between two select gates. The transistorsin series and the select gates are referred to as a NAND string. FIG. 1is a top view showing one NAND string. FIG. 2 is an equivalent circuitthereof. The NAND string depicted in FIGS. 1 and 2 includes fourtransistors, 100, 102, 104 and 106, in series and sandwiched between afirst select gate 120 and a second select gate 122. Select gate 120gates the NAND string connection to bit line 126. Select gate 122 gatesthe NAND string connection to source line 128. Select gate 120 iscontrolled by applying the appropriate voltages to control gate 120CG.Select gate 122 is controlled by applying the appropriate voltages tocontrol gate 122CG. Each of the transistors 100, 102, 104 and 106 has acontrol gate and a floating gate. Transistor 100 has control gate 100CGand floating gate 100FG. Transistor 102 includes control gate 102CG andfloating gate 102FG. Transistor 104 includes control gate 104CG andfloating gate 104FG. Transistor 106 includes a control gate 106CG andfloating gate 106FG. Control gate 100CG is connected to (or is) wordline WL3, control gate 102CG is connected to word line WL2, control gate104CG is connected to word line WL1, and control gate 106CG is connectedto word line WL0. In one embodiment, transistors 100, 102, 104 and 106are each storage elements, also referred to as memory cells. In otherembodiments, the storage elements may include multiple transistors ormay be different than that depicted in FIGS. 1 and 2. Select gate 120 isconnected to select line SGD. Select gate 122 is connected to selectline SGS.

FIG. 3 provides a cross-sectional view of the NAND string describedabove. As depicted in FIG. 3, the transistors of the NAND string areformed in p-well region 140. Each transistor includes a stacked gatestructure that consists of a control gate (100CG, 102CG, 104CG and106CG) and a floating gate (100FG, 102FG, 104FG and 106FG). The controlgates and the floating gates are typically formed by depositingpoly-silicon layers. The floating gates are formed on the surface of thep-well on top of an oxide or other dielectric film. The control gate isabove the floating gate, with an inter-polysilicon dielectric layerseparating the control gate and floating gate. The control gates of thestorage elements (100, 102, 104 and 106) form the word lines. N+ dopeddiffusion regions 130, 132, 134, 136 and 138 are shared betweenneighboring storage elements, through which the storage elements areconnected to one another in series to form a NAND string. These N+ dopedregions form the source and drain of each of the storage elements. Forexample, N+ doped region 130 serves as the drain of transistor 122 andthe source for transistor 106, N+ doped region 132 serves as the drainfor transistor 106 and the source for transistor 104, N+ doped region134 serves as the drain for transistor 104 and the source for transistor102, N+ doped region 136 serves as the drain for transistor 102 and thesource for transistor 100, and N+ doped region 138 serves as the drainfor transistor 100 and the source for transistor 120. N+ doped region126 connects to the bit line for the NAND string, while N+ doped region128 connects to a common source line for multiple NAND strings.

Note that although FIGS. 1-3 show four storage elements in the NANDstring, the use of four transistors is provided only as an example. ANAND string used with the technology described herein can have less thanfour storage elements or more than four storage elements. For example,some NAND strings will include eight, sixteen, thirty-two or sixty-fourstorage elements, etc. The discussion herein is not limited to anyparticular number of storage elements in a NAND string.

Each storage element can store data represented in analog or digitalform. When storing one bit of digital data, the range of possiblethreshold voltages of the storage element is divided into two ranges,which are assigned logical data “1” and “0.” In one example of aNAND-type flash memory, the threshold voltage is negative after thestorage element is erased, and defined as logic “1.” The thresholdvoltage is positive after a program operation, and defined as logic “0.”When the threshold voltage is negative and a read is attempted byapplying 0 V to the control gate, the storage element will turn on toindicate logic one is being stored. When the threshold voltage ispositive and a read operation is attempted by applying 0 V to thecontrol gate, the storage element will not turn on, which indicates thatlogic zero is stored.

A storage element can also store multiple states, thereby storingmultiple bits of digital data. In the case of storing multiple states ofdata, the threshold voltage window is divided into the number of states.For example, if four states are used, there will be four thresholdvoltage ranges assigned to the data values “11,” “10,” “01,” and “00.”In one example of a NAND-type memory, the threshold voltage after anerase operation is negative and defined as “11.” Positive thresholdvoltages are used for the states of “10,” “01,” and “00.” In someimplementations, the data values (e.g., logical states) are assigned tothe threshold ranges using a Gray code assignment so that if thethreshold voltage of a floating gate erroneously shifts to itsneighboring physical state, only one bit will be affected. The specificrelationship between the data programmed into the storage element andthe threshold voltage ranges of the storage element depends upon thedata encoding scheme adopted for the storage elements. For example, U.S.Pat. No. 6,222,762 and U.S. patent application Ser. No. 10/461,244,“Tracking Cells For A Memory System,” filed on Jun. 13, 2003, (now U.S.Pat. No. 7,237,074), both of which are incorporated herein by referencein their entirety, describe various data encoding schemes formulti-state flash storage elements.

Relevant examples of NAND-type flash memories and their operation areprovided in the following U.S. patents/patent applications, all of whichare incorporated herein by reference in their entirety: U.S. Pat. No.5,570,315; U.S. Pat. No. 5,774,397; U.S. Pat. No. 6,046,935; U.S. Pat.No. 5,386,422; U.S. Pat. No. 6,456,528; and U.S. Pat. No. 6,522,580.Other types of non-volatile memory in addition to NAND flash memory canalso be used with the present invention.

Another type of storage element useful in flash EEPROM systems utilizesa non-conductive dielectric material in place of a conductive floatinggate to store charge in a non-volatile manner. Such a storage element isdescribed in an article by Chan et al., “A True Single-TransistorOxide-Nitride-Oxide EEPROM Device,” IEEE Electron Device Letters, Vol.EDL-8, No. 3, March 1987, pp. 93-95. A triple layer dielectric formed ofsilicon oxide, silicon nitride and silicon oxide (“ONO”) is sandwichedbetween a conductive control gate and a surface of a semi-conductivesubstrate above the storage element channel. The storage element isprogrammed by injecting electrons from the storage element channel intothe nitride, where they are trapped and stored in a limited region. Thisstored charge then changes the threshold voltage of a portion of thechannel of the storage element in a manner that is detectable. Thestorage element is erased by injecting hot holes into the nitride. Seealso Nozaki et al., “A 1-Mb EEPROM with MONOS Memory Cell forSemiconductor Disk Application,” IEEE Journal of Solid-State Circuits,Vol. 26, No. 4, April 1991, pp. 497-501, which describes a similarstorage element in a split-gate configuration where a doped polysilicongate extends over a portion of the storage element channel to form aseparate select transistor. The foregoing two articles are incorporatedherein by reference in their entirety. The programming techniquesmentioned in section 1.2 of “Nonvolatile Semiconductor MemoryTechnology,” edited by William D. Brown and Joe E. Brewer, IEEE Press,1998, incorporated herein by reference, are also described in thatsection to be applicable to dielectric charge-trapping devices. Thestorage elements described in this paragraph can also be used with thepresent invention. Thus, the technology described herein also applies tocoupling between dielectric regions of different storage elements.

Another approach to storing two bits in each storage element has beendescribed by Eitan et al., “NROM: A Novel Localized Trapping, 2-BitNonvolatile Memory Cell,” IEEE Electron Device Letters, vol. 21, no. 11,November 2000, pp. 543-545. An ONO dielectric layer extends across thechannel between source and drain diffusions. The charge for one data bitis localized in the dielectric layer adjacent to the drain, and thecharge for the other data bit localized in the dielectric layer adjacentto the source. Multi-state data storage is obtained by separatelyreading binary states of the spatially separated charge storage regionswithin the dielectric. The storage elements described in this paragraphcan also be used with the present invention.

FIG. 4 illustrates an example of an array of NAND storage elements, suchas those shown in FIGS. 1-3. Along each column, a bit line 206 iscoupled to the drain terminal 126 of the drain select gate for the NANDstring 150. Along each row of NAND strings, a source line 204 mayconnect all the source terminals 128 of the source select gates of theNAND strings. An example of a NAND architecture array and its operationas part of a memory system is found in U.S. Pat. Nos. 5,570,315;5,774,397; and 6,046,935.

The array of storage elements is divided into a large number of blocksof storage elements. As is common for flash EEPROM systems, the block isthe unit of erase. That is, each block contains the minimum number ofstorage elements that are erased together. Each block is typicallydivided into a number of pages. A page is a unit of programming. In oneembodiment, the individual pages may be divided into segments and thesegments may contain the fewest number of storage elements that arewritten at one time as a basic programming operation. One or more pagesof data are typically stored in one row of storage elements. A page canstore one or more sectors. A sector includes user data and overheaddata. Overhead data typically includes an Error Correction Code (ECC)that has been calculated from the user data of the sector. A portion ofthe controller (described below) calculates the ECC when data is beingprogrammed into the array, and also checks it when data is being readfrom the array. Alternatively, the ECCs and/or other overhead data arestored in different pages, or even different blocks, than the user datato which they pertain.

A sector of user data is typically 512 bytes, corresponding to the sizeof a sector in magnetic disk drives. Overhead data is typically anadditional 16-20 bytes. A large number of pages form a block, anywherefrom 8 pages, for example, up to 32, 64, 128 or more pages. In someembodiments, a row of NAND strings comprises a block.

Memory storage elements are erased in one embodiment by raising thep-well to an erase voltage (e.g., 20 V) for a sufficient period of timeand grounding the word lines of a selected block while the source andbit lines are floating. Due to capacitive coupling, the unselected wordlines, bit lines, select lines, and c-source are also raised to asignificant fraction of the erase voltage. A strong electric field isthus applied to the tunnel oxide layers of selected storage elements andthe data of the selected storage elements are erased as electrons of thefloating gates are emitted to the substrate side, typically byFowler-Nordheim tunneling mechanism. As electrons are transferred fromthe floating gate to the p-well region, the threshold voltage of aselected storage element is lowered. Erasing can be performed on theentire memory array, separate blocks, or another unit of storageelements.

FIG. 5 illustrates a memory device 296 having read/write circuits forreading and programming a page of storage elements in parallel,according to one embodiment of the present invention. Memory device 296may include one or more memory die 298. Memory die 298 includes atwo-dimensional array of storage elements 300, control circuitry 310,and read/write circuits 365. In some embodiments, the array of storageelements can be three dimensional. The memory array 300 is addressableby word lines via a row decoder 330 and by bit lines via a columndecoder 360. The read/write circuits 365 include multiple sense blocks400 and allow a page of storage elements to be read or programmed inparallel. Typically a controller 350 is included in the same memorydevice 296 (e.g., a removable storage card) as the one or more memorydie 298. Commands and Data are transferred between the host andcontroller 350 via lines 320 and between the controller and the one ormore memory die 298 via lines 318.

The control circuitry 310 cooperates with the read/write circuits 365 toperform memory operations on the memory array 300. The control circuitry310 includes a state machine 312, an on-chip address decoder 314, atemperature compensation control 315 and a power control module 316. Thetemperature compensation control 315 is discussed further below,particularly in connection with FIG. 14. The state machine 312 provideschip-level control of memory operations. The on-chip address decoder 314provides an address interface between that used by the host or a memorycontroller to the hardware address used by the decoders 330 and 360. Thepower control module 316 controls the power and voltages supplied to theword lines and bit lines during memory operations.

In some implementations, some of the components of FIG. 5 can becombined. In various designs, one or more of the components of FIG. 5(alone or in combination), other than storage element array 300, can bethought of as a managing circuit. For example, one or more managingcircuits may include any one of or a combination of control circuitry310, state machine 312, decoders 314/360, power control 316, senseblocks 400, read/write circuits 365, controller 350, etc.

FIG. 6 illustrates another arrangement of the memory device 296 shown inFIG. 5. Access to the memory array 300 by the various peripheralcircuits is implemented in a symmetric fashion, on opposite sides of thearray, so that the densities of access lines and circuitry on each sideare reduced by half. Thus, the row decoder is split into row decoders330A and 330B and the column decoder into column decoders 360A and 360B.Similarly, the read/write circuits are split into read/write circuits365A connecting to bit lines from the bottom and read/write circuits365B connecting to bit lines from the top of the array 300. In this way,the density of the read/write modules is essentially reduced by onehalf. The device of FIG. 6 can also include a controller, as describedabove for the device of FIG. 5.

FIG. 7 is a block diagram of an individual sense block 400 partitionedinto a core portion, referred to as a sense module 380, and a commonportion 390. In one embodiment, there will be a separate sense module380 for each bit line and one common portion 390 for a set of multiplesense modules 380. In one example, a sense block will include one commonportion 390 and eight sense modules 380. Each of the sense modules in agroup will communicate with the associated common portion via a data bus372. For further details refer to U.S. patent application Ser. No.11/026,536 “Non-Volatile Memory & Method with Shared Processing for anAggregate of Sense Amplifiers” filed on Dec. 29, 2004, (now US2006/0140007) which is incorporated herein by reference in its entirety.

Sense module 380 comprises sense circuitry 370 that determines whether aconduction current in a connected bit line is above or below apredetermined threshold level. Sense module 380 also includes a bit linelatch 382 that is used to set a voltage condition on the connected bitline. For example, a predetermined state latched in bit line latch 382will result in the connected bit line being pulled to a statedesignating program inhibit (e.g., Vdd).

Common portion 390 comprises a processor 392, a set of data latches 394and an I/O Interface 396 coupled between the set of data latches 394 anddata bus 320. Processor 392 performs computations. For example, one ofits functions is to determine the data stored in the sensed storageelement and store the determined data in the set of data latches. Theset of data latches 394 is used to store data bits determined byprocessor 392 during a read operation. It is also used to store databits imported from the data bus 320 during a program operation. Theimported data bits represent write data meant to be programmed into thememory. I/O interface 396 provides an interface between data latches 394and the data bus 320.

During read or sensing, the operation of the system is under the controlof state machine 312 that controls the supply of different control gatevoltages to the addressed storage element. As it steps through thevarious predefined control gate voltages corresponding to the variousmemory states supported by the memory, the sense module 380 may trip atone of these voltages and an output will be provided from sense module380 to processor 392 via bus 372. At that point, processor 392determines the resultant memory state by consideration of the trippingevent(s) of the sense module and the information about the appliedcontrol gate voltage from the state machine via input lines 393. It thencomputes a binary encoding for the memory state and stores the resultantdata bits into data latches 394. In another embodiment of the coreportion, bit line latch 382 serves double duty, both as a latch forlatching the output of the sense module 380 and also as a bit line latchas described above.

It is anticipated that some implementations will include multipleprocessors 392. In one embodiment, each processor 392 will include anoutput line (not depicted in FIG. 7) such that each of the output linesis wired-OR'd together. In some embodiments, the output lines areinverted prior to being connected to the wired-OR line. Thisconfiguration enables a quick determination during the programverification process of when the programming process has completedbecause the state machine receiving the wired-OR can determine when allbits being programmed have reached the desired level. For example, wheneach bit has reached its desired level, a logic zero for that bit willbe sent to the wired-OR line (or a data one is inverted). When all bitsoutput a data 0 (or a data one inverted), then the state machine knowsto terminate the programming process. Because each processorcommunicates with eight sense modules, the state machine needs to readthe wired-OR line eight times, or logic is added to processor 392 toaccumulate the results of the associated bit lines such that the statemachine need only read the wired-OR line one time. Similarly, bychoosing the logic levels correctly, the global state machine can detectwhen the first bit changes its state and change the algorithmsaccordingly.

During program or verify, the data to be programmed is stored in the setof data latches 394 from the data bus 320. The program operation, underthe control of the state machine, comprises a series of programmingvoltage pulses applied to the control gates of the addressed storageelements. Each programming pulse is followed by a read back (verify) todetermine if the storage element has been programmed to the desiredmemory state. Processor 392 monitors the read back memory state relativeto the desired memory state. When the two are in agreement, theprocessor 222 sets the bit line latch 214 so as to cause the bit line tobe pulled to a state designating program inhibit. This inhibits thestorage element coupled to the bit line from further programming even ifprogramming pulses appear on its control gate. In other embodiments theprocessor initially loads the bit line latch 382 and the sense circuitrysets it to an inhibit value during the verify process.

Data latch stack 394 contains a stack of data latches corresponding tothe sense module. In one embodiment, there are three data latches persense module 380. In some implementations (but not required), the datalatches are implemented as a shift register so that the parallel datastored therein is converted to serial data for data bus 320, and viceversa. In the preferred embodiment, all the data latches correspondingto the read/write block of m storage elements can be linked together toform a block shift register so that a block of data can be input oroutput by serial transfer. In particular, the bank of r read/writemodules is adapted so that each of its set of data latches will shiftdata in to or out of the data bus in sequence as if they are part of ashift register for the entire read/write block.

Additional information about the structure and/or operations of variousembodiments of non-volatile storage devices can be found in (1) U.S.Patent Application Pub. No. 2004/0057287, “Non-Volatile Memory AndMethod With Reduced Source Line Bias Errors,” published on Mar. 25,2004; (2) U.S. Patent Application Pub No. 2004/0109357, “Non-VolatileMemory And Method with Improved Sensing,” published on Jun. 10, 2004;(3) U.S. patent application Ser. No. 11/015,199 titled “Improved MemorySensing Circuit And Method For Low Voltage Operation,” InventorRaul-Adrian Cernea, filed on Dec. 16, 2004 (now U.S. Pat. No.7,046,568); (4) U.S. patent application Ser. No. 11/099,133, titled“Compensating for Coupling During Read Operations of Non-VolatileMemory,” Inventor Jian Chen, filed on Apr. 5, 2005 (U.S. Pat. No.7,196,928); and (5) U.S. patent application Ser. No. 11/321,953, titled“Reference Sense Amplifier For Non-Volatile Memory, Inventors Siu LungChan and Raul-Adrian Cernea, filed on Dec. 28, 2005 (now US2006/0158947). All five of the immediately above-listed patent documentsare incorporated herein by reference in their entirety.

With reference to FIG. 8, an exemplary structure of storage elementarray 300 is described. As one example, a NAND flash EEPROM is describedthat is partitioned into 1,024 blocks. The data stored in each block canbe simultaneously erased. In one embodiment, the block is the minimumunit of storage elements that are simultaneously erased. In each block,in this example, there are 8,512 columns corresponding to bit lines BL0,BL1, . . . BL8511. In one embodiment, referred to as an all bit line(ABL) architecture, all the bit lines of a block can be simultaneouslyselected during read and program operations. Storage elements along acommon word line and connected to any bit line can be programmed at thesame time.

FIG. 8 shows four storage elements connected in series to form a NANDstring. Although four storage elements are shown to be included in eachNAND string, more or less than four can be used (e.g., 16, 32, 64 oranother number). One terminal of the NAND string is connected to acorresponding bit line via a drain select gate (connected to select gatedrain line SGD), and another terminal is connected to c-source via asource select gate (connected to select gate source line SGS).

In another embodiment, referred to as an odd-even architecture, the bitlines are divided into even bit lines and odd bit lines, as shown inFIG. 9. FIG. 9 illustrates an example of an organization of a memoryarray into blocks for an odd-even memory architecture. In an odd/evenbit line architecture, storage elements along a common word line andconnected to the odd bit lines are programmed at one time, while storageelements along a common word line and connected to even bit lines areprogrammed at another time. Data can be programmed into different blocksand read from different blocks concurrently. In each block, in thisexample, there are 8,512 columns that are divided into even columns andodd columns. The bit lines are also divided into even bit lines (BLe)and odd bit lines (BLo). In this example, four storage elements areshown connected in series to form a NAND string. Although four storageelements are shown to be included in each NAND string, more or fewerthan four storage elements can be used.

During one configuration of read and programming operations, 4,256storage elements are simultaneously selected. The storage elementsselected have the same word line and the same kind of bit line (e.g.,even or odd). Therefore, 532 bytes of data, which form a logical page,can be read or programmed simultaneously, and one block of the memorycan store at least eight logical pages (four word lines, each with oddand even pages). For multi-state storage elements, when each storageelement stores two bits of data, where each of these two bits are storedin a different page, one block stores sixteen logical pages. Other sizedblocks and pages can also be used.

For either the ABL or the odd-even architecture, storage elements can beerased by raising the p-well to an erase voltage (e.g., 20 V) andgrounding the word lines of a selected block. The source and bit linesare floating. Erasing can be performed on the entire memory array,separate blocks, or another unit of the storage elements which is aportion of the memory device. Electrons are transferred from thefloating gates of the storage elements to the p-well region so that theV_(TH) of the storage elements becomes negative.

In the read and verify operations, the select gates (SGD and SGS) areconnected to a voltage in a range of 2.5 to 4.5 V and the unselectedword lines (e.g., WL0, WL1 and WL3, when WL2 is the selected word line)are raised to a read pass voltage (typically a voltage in the range of4.5 to 6 V) to make the transistors operate as pass gates. The selectedword line WL2 is connected to a voltage, a level of which is specifiedfor each read and verify operation in order to determine whether aV_(TH) of the concerned storage element is above or below such level.For example, in a read operation for a two-level storage element, theselected word line WL2 may be grounded, so that it is detected whetherthe V_(TH) is higher than 0 V. In a verify operation for a two levelstorage element, the selected word line WL2 is connected to 0.8 V, forexample, so that it is verified whether or not the V_(TH) has reached atleast 0.8 V. The source and p-well are at 0 V. The selected bit lines,assumed to be the even bit lines (BLe), are pre-charged to a level of,for example, 0.7 V. If the V_(TH) is higher than the read or verifylevel on the word line, the potential level of the bit line (BLe)associated with the storage element of interest maintains the high levelbecause of the non-conductive storage element. On the other hand, if theV_(TH) is lower than the read or verify level, the potential level ofthe concerned bit line (BLe) decreases to a low level, for example, lessthan 0.5 V, because the conductive storage element discharges thebitline. The state of the storage element can thereby be detected by avoltage comparator sense amplifier that is connected to the bit line.

The erase, read and verify operations described above are performedaccording to techniques known in the art. Thus, many of the detailsexplained can be varied by one skilled in the art. Other erase, read andverify techniques known in the art can also be used.

FIG. 10 illustrates example threshold voltage distributions for thestorage element array when each storage element stores two bits of data.A first threshold voltage distribution E is provided for erased storageelements. Three threshold voltage distributions, A, B and C forprogrammed storage elements, are also depicted. In one embodiment, thethreshold voltages in the E distribution are negative and the thresholdvoltages in the A, B and C distributions are positive.

Each distinct threshold voltage range corresponds to predeterminedvalues for the set of data bits. The specific relationship between thedata programmed into the storage element and the threshold voltagelevels of the storage element depends upon the data encoding schemeadopted for the storage elements. For example, U.S. Pat. No. 6,222,762and U.S. Patent Application Publication No. 2004/0255090, published Dec.16, 2004, both of which are incorporated herein by reference in theirentirety, describe various data encoding schemes for multi-state flashstorage elements. In one embodiment, data values are assigned to thethreshold voltage ranges using a Gray code assignment so that if thethreshold voltage of a floating gate erroneously shifts to itsneighboring physical state, only one bit will be affected. One exampleassigns “11” to threshold voltage range E (state E), “10” to thresholdvoltage range A (state A), “00” to threshold voltage range B (state B)and “01” to threshold voltage range C (state C). However, in otherembodiments, Gray code is not used. Although four states are shown, thepresent invention can also be used with other multi-state structuresincluding those that include more or less than four states.

Three read reference voltages, Vra, Vrb and Vrc, are also provided forreading data from storage elements. By testing whether the thresholdvoltage of a given storage element is above or below Vra, Vrb and Vrc,the system can determine what state the storage element is in.

Further, three verify reference voltages, Vva, Vvb and Vvc, areprovided. When programming storage elements to state A, the system willtest whether those storage elements have a threshold voltage greaterthan or equal to Vva. When programming storage elements to state B, thesystem will test whether the storage elements have threshold voltagesgreater than or equal to Vvb. When programming storage elements to stateC, the system will determine whether storage elements have theirthreshold voltage greater than or equal to Vvc.

In one embodiment, known as full sequence programming, storage elementscan be programmed from the erase state E directly to any of theprogrammed states A, B or C. For example, a population of storageelements to be programmed may first be erased so that all storageelements in the population are in erased state E. A series ofprogramming pulses such as depicted by the control gate voltage sequenceof FIG. 13 will then be used to program storage elements directly intostates A, B or C. While some storage elements are being programmed fromstate E to state A, other storage elements are being programmed fromstate E to state B and/or from state E to state C. When programming fromstate E to state C on WLn, the amount of parasitic coupling to theadjacent floating gate under WLn−1 is a maximized since the change inamount of charge on the floating gate under WLn is largest as comparedto the change in voltage when programming from state E to state A orstate E to state B. When programming from state E to state B the amountof coupling to the adjacent floating gate is reduced but stillsignificant. When programming from state E to state A the amount ofcoupling is reduced even further. Consequently the amount of correctionrequired to subsequently read each state of WLn−1 will vary depending onthe state of the adjacent storage element on WLn.

FIG. 11 illustrates an example of a two-pass technique of programming amulti-state storage element that stores data for two different pages: alower page and an upper page. Four states are depicted: state E (11),state A (10), state B (00) and state C (01). For state E, both pagesstore a “1.” For state A, the lower page stores a “0” and the upper pagestores a “1.” For state B, both pages store “0.” For state C, the lowerpage stores “1” and the upper page stores “0.” Note that althoughspecific bit patterns have been assigned to each of the states,different bit patterns may also be assigned.

In a first programming pass, the storage element's threshold voltagelevel is set according to the bit to be programmed into the lowerlogical page. If that bit is a logic “1,” the threshold voltage is notchanged since it is in the appropriate state as a result of having beenearlier erased. However, if the bit to be programmed is a logic “0,” thethreshold level of the storage element is increased to be state A, asshown by arrow 1100. That concludes the first programming pass.

In a second programming pass, the storage element's threshold voltagelevel is set according to the bit being programmed into the upperlogical page. If the upper logical page bit is to store a logic “1,”then no programming occurs since the storage element is in one of thestates E or A, depending upon the programming of the lower page bit,both of which carry an upper page bit of “1.” If the upper page bit isto be a logic “0,” then the threshold voltage is shifted. If the firstpass resulted in the storage element remaining in the erased state E,then in the second phase the storage element is programmed so that thethreshold voltage is increased to be within state C, as depicted byarrow 1120. If the storage element had been programmed into state A as aresult of the first programming pass, then the storage element isfurther programmed in the second pass so that the threshold voltage isincreased to be within state B, as depicted by arrow 1110. The result ofthe second pass is to program the storage element into the statedesignated to store a logic “0” for the upper page without changing thedata for the lower page. In both FIG. 10 and FIG. 11 the amount ofcoupling to the floating gate on the adjacent word line depends on thefinal state.

In one embodiment, a system can be set up to perform full sequencewriting if enough data is written to fill up an entire page. If notenough data is written for a full page, then the programming process canprogram the lower page programming with the data received. Whensubsequent data is received, the system will then program the upperpage. In yet another embodiment, the system can start writing in themode that programs the lower page and convert to full sequenceprogramming mode if enough data is subsequently received to fill up anentire (or most of a) word line's storage elements. More details of suchan embodiment are disclosed in U.S. patent application Ser. No.11/013,125, titled “Pipelined Programming of Non-Volatile Memories UsingEarly Data,” filed on Dec. 14, 2004, by inventors Sergy A. Gorobets andYan Li, (now U.S. Pat. No. 7,120,051), incorporated herein by referencein its entirety.

FIGS. 12A-C disclose another process for programming non-volatile memorythat reduces the effect of floating gate to floating gate coupling by,for any particular storage element, writing to that particular storageelement with respect to a particular page subsequent to writing toadjacent storage elements for previous pages. In one exampleimplementation, the non-volatile storage elements store two bits of dataper storage element, using four data states. For example, assume thatstate E is the erased state and states A, B and C are the programmedstates. State E stores data 11. State A stores data 01. State B storesdata 10. State C stores data 00. This is an example of non-Gray codingbecause both bits change between adjacent states A and B. Otherencodings of data to physical data states can also be used. Each storageelement stores two pages of data. For reference purposes, these pages ofdata will be called upper page and lower page; however, they can begiven other labels. With reference to state A, the upper page stores bit0 and the lower page stores bit 1. With reference to state B, the upperpage stores bit 1 and the lower page stores bit 0. With reference tostate C, both pages store bit data 0.

The programming process is a two-step process. In the first step, thelower page is programmed. If the lower page is to remain data 1, thenthe storage element state remains at state E. If the data is to beprogrammed to 0, then the threshold of voltage of the storage element israised such that the storage element is programmed to state B′. FIG. 12Atherefore shows the programming of storage elements from state E tostate B′. State B′ is an interim state B; therefore, the verify point isdepicted as Vvb′, which is lower than Vvb.

In one embodiment, after a storage element is programmed from state E tostate B′, its neighbor storage element (WLn+1) in the NAND string willthen be programmed with respect to its lower page. For example, lookingback at FIG. 2, after the lower page for storage element 106 isprogrammed, the lower page for storage element 104 would be programmed.After programming storage element 104, the floating gate to floatinggate coupling effect will raise the apparent threshold voltage ofstorage element 106 if storage element 104 had a threshold voltageraised from state E to state B′. This will have the effect of wideningthe threshold voltage distribution for state B′ to that depicted asthreshold voltage distribution 1250 of FIG. 12B. This apparent wideningof the threshold voltage distribution will be remedied when programmingthe upper page.

FIG. 12C depicts the process of programming the upper page. If thestorage element is in erased state E and the upper page is to remain at1, then the storage element will remain in state E. If the storageelement is in state E and its upper page data is to be programmed to 0,then the threshold voltage of the storage element will be raised so thatthe storage element is in state A. If the storage element was inintermediate threshold voltage distribution 1250 and the upper page datais to remain at 1, then the storage element will be programmed to finalstate B. If the storage element is in intermediate threshold voltagedistribution 1250 and the upper page data is to become data 0, then thethreshold voltage of the storage element will be raised so that thestorage element is in state C. The process depicted by FIGS. 12A-Creduces the effect of floating gate to floating gate coupling becauseonly the upper page programming of neighbor storage elements will havean effect on the apparent threshold voltage of a given storage element.An example of an alternate state coding is to move from distribution1250 to state C when the upper page data is a 1, and to move to state Bwhen the upper page data is a 0.

Although FIGS. 12A-C provide an example with respect to four data statesand two pages of data, the concepts taught by FIGS. 12A-C can be appliedto other implementations with more or less than four states anddifferent than two pages.

FIG. 13 shows a voltage waveform 1300 which includes a series of programpulses 1310, 1320, 1330, 1340, 1350, . . . , that are applied to a wordline selected for programming. In one embodiment, the programming pulseshave a voltage, Vpgm, which starts at 12 V and increases by increments,e.g., 0.5 V, for each successive programming pulses until a maximum of20 V is reached. In between the program pulses are sets of verify pulses1312, 1322, 1332, 1342, 1352, . . . . In some embodiments, there can bea verify pulse for each state that data is being programmed into. Inother embodiments, there can be more or fewer verify pulses. The verifypulses in each set can have amplitudes of Vva, Vvb and Vvc (FIG. 10),for instance.

In one embodiment, data is programmed to storage elements along a commonword line. Thus, prior to applying the program pulses, one of the wordlines is selected for programming. This word line will be referred to asthe selected word line. The remaining word lines of a block are referredto as the unselected word lines. The selected word line may have one ortwo neighboring word lines. If the selected word line has twoneighboring word lines, then the neighboring word line on the drain sideis referred to as the drain side neighboring word line and theneighboring word line on the source side is referred to as the sourceside neighboring word line. For example, if WL2 of FIG. 2 is theselected word line, then WL1 is the source side neighboring word lineand WL3 is the drain side neighboring word line.

Each block of storage elements includes a set of bit lines formingcolumns and a set of word lines forming rows. In one embodiment, the bitlines are divided into odd bit lines and even bit lines. Storageelements along a common word line and connected to the odd bit lines areprogrammed at one time, while storage elements along a common word lineand connected to even bit lines are programmed at another time(“odd/even programming”). In another embodiment, storage elements areprogrammed along a word line for all bit lines in the block (“all bitline programming”). In other embodiments, the bit lines or block can bebroken up into other groupings (e.g., left and right, more than twogroupings, etc.).

FIG. 14 illustrates a threshold voltage change with temperature and wordline position. Line 1410 denotes a temperature coefficient versus wordline position relationship. Line 1420 denotes a ratio of change inthreshold voltage to a change in temperature (ΔV_(T)/° C.) versus wordline position, with temperature compensation of Vread, the voltageapplied to the unselected word lines. In this case, the magnitude of thetemperature dependency is reduced, while a word line position dependencyremains, although the word line position dependency is reduced. Line1430 denotes a ΔV_(T)/° C. versus word line position relationship, withtemperature compensation of Vread, the voltage applied to the unselectedword line, and of Vcgr, the voltage applied to the selected word line.In this case, the magnitude of the temperature dependency is reducedfurther relative to line 1420, while a word line position dependencystill remains. Line 1440 denotes a ΔV_(T)/° C. versus word line positionrelationship, with temperature compensation of Vread, the voltageapplied to the unselected word line, and of Vcgr, the voltage applied tothe selected word line, with a further word line position dependency ofVcgr. In this case, the word line position dependency is essentiallyremoved relative to the case of line 1430. A word line dependency mayalso be applied to the unselected word lines via Vread.

In particular, it has been observed that the threshold voltage of anon-volatile storage element decreases as temperature increases. Thechange in voltage relative to the change in temperature can be expressedin terms of a temperature coefficient (α) which is typically about −2mV/° C. The temperature coefficient depends on various characteristicsof the memory device, such as doping, layout and so forth. Moreover, thetemperature coefficient is expected to increase in magnitude as memorydimensions are reduced. The temperature coefficient can identify a ratioof a change in voltage or current to a change in temperature. With anoperating range of −40° C. to +85° C., for instance, the thresholdvoltage can vary by about (85−(−40))×(−2)=250 mV. Thus, the accuracy ofa read or verify operation of one or more selected storage elementsassociated with a selected word line can be improved by biasing the reador verify voltage which is applied to the selected word line based ontemperature. Furthermore, the temperature coefficient can vary accordingto word line position, as indicated by line 1410, when no wordline-dependent temperature compensation is used. For example, line 1410can have a value of about −1.9 mV/° C. at WL0, the source side wordline, and a value of about −2.1 mV/° C. at WL31, the drain side wordline, assuming there are thirty-two word lines in a block. Thus, thevariation in the temperature coefficient is 0.2 mV across the wordlines, in one possible design. Experimental data obtained from a 70 nmABL architecture chip shows an approximately 15% change in average pagetemperature coefficient based on word line address, where WL31, havingits series resistance completely on its source side, suffers more fromtemperature induced series resistance change on its source side, causingadditional body effect, than a WL0 page, which also experiences a changein series resistance, albeit only at its drain side.

Various techniques are known for providing temperature-compensated readvoltages to a selected word line. Most of these techniques do not relyon obtaining an actual temperature measurement, although this approachis also possible. For example, U.S. Pat. No. 6,801,454, titled “VoltageGeneration Circuitry Having Temperature Compensation,” incorporatedherein by reference, describes a voltage generation circuit whichoutputs read voltages to a non-volatile memory based on a temperaturecoefficient. The circuit uses a band gap current which includes atemperature-independent portion and a temperature-dependent portionwhich increases as temperature increases. U.S. Pat. No. 6,560,152,titled “Non-Volatile Memory With Temperature-Compensated Data Read”,incorporated herein by reference, uses a bias generator circuit whichbiases a voltage which is applied to a source or drain of a data storageelement. U.S. Pat. No. 5,172,338, titled “Multi-State EEPROM Read andWrite Circuits and Techniques”, incorporated herein by reference,describes a temperature-compensation technique which uses referencestorage cells that are formed in the same manner as data storage cellsand on the same integrated circuit chip. The reference storage cellsprovide reference levels against which measured currents or voltages ofthe selected cells are compared. Temperature compensation is providedsince the reference levels are affected by temperature in the samemanner as the values read from the data storage cells. Any of the thesetechniques, as well as any other known techniques, can be used toprovide temperature-compensation of voltages of selected word lines,unselected word lines and/or select gates as described herein.

Thus, with the conventional techniques, the read or verify voltageapplied to one or more selected storage elements via a selected wordline is temperature compensated. However, the voltage which is appliedto the remaining word lines, referred to as a read voltage, Vread, andthe voltage which is applied to the select gates, referred to as Vsgsfor the select gate, source or Vsgd for the select gate, drain, have notbeen temperature compensated. It has been thought thattemperature-compensation of only the selected storage element issufficient. In particular, it has been thought that the unselectedstorage elements and the select gates are over driven sufficientlybeyond their threshold voltages such that changes in temperature do notsignificantly affect their conductivity. However, as transistors arescaled to ever smaller dimensions, their characteristics degrade, andthe saturation currents deviate more and more from having a flatprofile, as represented by a small slope in the graph of drain current(I_(D)) verses control gate voltage (Vcg).

To address these concerns, it is proposed that Vread, Vsgd, Vsgs, andany other critical transistor in the path of a storage element which iscurrently being read have temperature compensated biases applied totheir gates, such that each transistor's on current becomes lessdependent on temperature. By making these applied voltages track withtemperature, the spreading of each state's threshold distribution whichis caused by changes in temperature can be further reduced. This resultcan be taken advantage of in a number of ways which are not necessarilymutually exclusive. For example, Vread can be reduced. Thus, the amountof overdrive, that is, the extent to which Vread exceeds the thresholdvoltage of the highest programmed state of the storage elements, can bereduced, thereby reducing the associated read disturb caused by usinghigh values of Vread.

This reduction of Vread is helpful with many different read/verifytechniques. The reduction is particularly important with read/verifytechniques which employ multiple read operations. For example,co-pending U.S. patent application Ser. No. 11/099,133, filed Apr. 5,2005, to Jian Chen, titled “Compensating For Coupling During ReadOperations Of Non-Volatile Memory”, (now U.S. Pat. No. 7,196,928),Docket No. SAND-1040US0, incorporated herein by reference, describes aread technique in which multiple read operations at different levels areperformed for the selected storage elements for each programming state.The increment between levels can be 50-100 mV, for instance. Thetechnique combats the effects of word line-to-word line capacitivecoupling, in which the threshold voltage of a previously programmedstorage element is shifted higher when a neighboring storage element(typically a drain side neighbor) is subsequently programmed. If theshift is great enough, a read error can result. The coupling is highestwhen the neighboring storage element is programmed to a higher state,e.g., state C. To address this, one of the multiple read operations foreach programming state is selected based on the state of the neighboringstorage element on the neighboring word line which was programmed afterthe selected storage element.

In a variation of this technique, one read level is used for each stateon the selected word line, as shown by the sets of verify pulses in FIG.13, while the read voltage which is applied to the neighboring word lineis adjusted. This variation is described in co-pending U.S. patentapplication Ser. No. 11/384,057, filed Mar. 17, 2006, to Nima Mokhlesi,titled “Read Operation For Non-Volatile Storage With Compensation ForCoupling”, Docket No. SAND-1089US2, (now US 2007/0206421), incorporatedherein by reference. In either case, due to the increased number of readoperations for reading the same amount of data, the exposure to readdisturbs is increased. The temperature-compensation techniques providedherein mitigate this problem.

A further advantage of the temperature-compensation techniques providedherein is that the margin between threshold voltage distributions ofvarious programming states, e.g., states E, A, B and C, can be increasedas the spreading of each state's threshold voltage distribution which iscaused by changes in temperature is reduced. Another advantage is thatprogramming performance can be increased, such as by using a larger stepsize in the stair case series of programming pulses (FIG. 13) byconsuming the increased margin between threshold voltage distributionsof various programming states. Another advantage is that the entirememory operating window, e.g., the range of threshold voltages used tostore data in the storage elements, can be reduced by packing theprogramming states closer together. This not only reduces both read andwrite disturbs, but also increases write performance because fewerprogramming pulses will be required to reach a desired programming statedue to a smaller window.

Accuracy may be improved even further by providing atemperature-compensated voltage which accounts for a relative positionof the selected word line among the other, unselected word lines whichare associated with a set of non-volatile storage elements. Theimprovement in accuracy can be seen by comparing line 1440 to line 1430.This temperature compensation can be performed alone on the selectedword line, or in conjunction with the temperature compensation of theunselected world lines. See FIG. 15 b. A word line dependency can alsobe provided for the unselected word lines.

FIG. 15 a is a timing diagram that explains the behavior of certainwaveforms during read/verify operations, where temperature-compensatedvoltages are applied to all unselected word lines and to both selectgates. In general, during read and verify operations, the selected wordline or other control line is connected to a voltage, a level of whichis specified for each read and verify operation, in order to determinewhether a threshold voltage of the concerned storage element has reachedsuch level. After applying the word line voltage, the conduction currentof the storage element is measured to determine whether the storageelement turned on. If the conduction current is measured to be greaterthan a certain value, then it is assumed that the storage element turnedon and the voltage applied to the word line is greater than thethreshold voltage of the storage element. If the conduction current isnot measured to be greater than the certain value, then it is assumedthat the storage element did not turn on and the voltage applied to theword line is not greater than the threshold voltage of the storageelement.

There are many ways to measure the conduction current of a storageelement during a read or verify operation. In one example, theconduction current of a storage element is measured by the rate itallows (or fails to allow) the NAND string that included the storageelement to discharge the bit line. The charge on the bit line ismeasured after a period of time to see whether it has been discharged ornot. In another embodiment, the conduction of the selected storageelement allows current to flow or not flow on a bit line, which ismeasured by whether a capacitor in the sense amplifier is charged due tothe flow of current. Both examples are discussed.

FIG. 15 a shows waveforms SGD, WLunselected, WLn, SGS, Selected BL, andSource starting at a steady state voltage, Vss, of approximately 0 V.SGD represents the gate of the drain side select gate. WLunselectedrepresents the unselected word lines. WLn is the word line selected forreading/verification. SGS is the gate of the source side select gate.Selected BL is the bit line selected for reading/verification. Source isthe source line for the storage elements (see FIG. 4). Note that thereare two versions of SGS and Selected BL depicted. One set of thesewaveforms SGS (option 1) and Selected BL (option 1), depict aread/verify operation for an array of storage elements that measure theconduction current of a storage element by determining whether the bitline has discharged. Another set of these waveforms SGS (option 2) andSelected BL (option 2), depict a read/verify operation for an array ofstorage elements that measure the conduction current of a storageelement by the rate it discharges a dedicated capacitor in the senseamplifier.

First, the behavior of the sensing circuits and the array of storageelements that are involved in measuring the conduction current of astorage element by determining whether the bit line has discharged willbe discussed with respect to SGS (option 1) and Selected BL (option 1).At time t1, SGD and SGS (option 2) are raised to Vsgd-tc and Vsgs-tc,respectively, where “tc” denotes a temperature-compensated voltage.Vsgd-tc and Vsgs are obtained by biasing Vsgd and Vsgs, respectively,for temperature. Vsgd and Vsgs are approximately 3.5 V, for instance.The temperature-compensation can be applied based on any of theabove-mentioned compensation techniques, for instance. The unselectedword lines are raised to Vread-tc. Vread-tc is obtained by biasing Vreadfor temperature. Vread is approximately 6 V, for instance. The selectedword line is raised to Vcgr-tc (control gate read voltage), e.g., Vra,Vrb, or Vrc of FIG. 10, for a read operation, or to a verify level,e.g., Vva, Vvb, or Vvc of FIG. 10, for a verify operation. The SelectedBL (option 1) is pre-charged to approximately 0.7 V, in one approach.Vread-tc, which is applied to the unselected word lines, acts as anoverdrive voltage because it causes the unselected storage elements toturn on and act as pass gates. The overdrive voltage applied to anunselected storage element equals the amount by which the voltageapplied to the control gate exceeds the threshold voltage.

As mentioned, Vread is chosen at a level which is sufficiently higherthan the highest threshold voltage of a storage element to ensure thatthe unselected storage element is in a conductive or on state. Forexample, the threshold voltages for states E, A, B and C may be assumedto be −2 V, 0 V, 2 V and 4 V, respectively, and Vread, withouttemperature compensation, may be 6 V. In this case, a storage element instate E is overdriven by 6−(−2)=8 V, a storage element in state A isoverdriven by 6−0=6 V, a storage element in state B is overdriven by6−2=4 V, and a storage element in state C is overdriven by 6−4=2 V.Although the unselected storage element is in a conductive state in eachcase, its conductivity will vary based on the extent to which it isoverdriven. An unselected storage element which is more overdriven ismore conductive because it has less source-to-drain resistance and morecurrent carrying capability. Similarly, an unselected storage elementwhich is less overdriven is less conductive because it has moresource-to-drain resistance and less current carrying capability. Thus,storage elements which are in the same NAND string as the selectedstorage element will have different conductivities based on theirprogramming states even though they are all in a generally conductivestate. The read level of the selected storage element will therefore beaffected by the unselected storage elements based on their respectiveprogramming states.

Assuming a temperature compensation of −0.2 V, Vread-tc=6-0.2 V=5.8 V.The voltage applied to the select gates can be temperature compensatedfor similar reasons as for the unselected storage elements, therebyallowing a Vsgd-tc or Vsgs-tc of 3.5−0.2=3.3 V, for example. Thetemperature compensation of the unselected word lines and the selectgates tends to make the reading of the threshold voltage of the selectedword line more temperature-independent. As a result, each unselectedstorage element in series with the selected storage element will have asmall effect, e.g., 3 mV, on the reading obtained for the thresholdvoltage of the selected storage element. While the effect of oneunselected storage element on the reading is small, the cumulativeeffect of each of the unselected storage elements can add up to asignificant level, e.g., 93 mV, when there are 31 unselected word lines.The effect of temperature-compensating the unselected world lines ismore pronounced for memory devices with more word lines, and whenreduced overdrive voltages are used.

At time t2, the NAND string can control the bit line. Also at time t2,the source side select gate is turned on by raising SGS (option 1) toVsgs-tc. This provides a path to dissipate the charge on the bit line.If the threshold voltage of the storage element selected for reading isgreater than Vcgr or the verify level applied to the selected word lineWLn, then the selected storage element will not turn on and the bit linewill not discharge, as depicted by line 1450. If the threshold voltagein the storage element selected for reading is below Vcgr-tc or belowthe verify level applied to the selected word line WLn, then the storageelement selected for reading will turn on (conduct) and the bit linevoltage will dissipate, as depicted by curve 1452. At some point aftertime t2 and prior to time t3 (as determined by the particularimplementation), the sense amplifier will determine whether the bit linehas dissipated a sufficient amount. In between t2 and t3, the senseamplifier measures the evaluated BL voltage. At time t3, the depictedwaveforms will be lowered to Vss (or another value for standby orrecovery).

Discussed next, with respect to SGS (option 2) and Selected BL (option2), is the behavior of the sensing circuits and the array of storageelements that measure the conduction current of a storage element by therate at which it charges a dedicated capacitor in the sense amplifier.At time t1, SGD is raised to Vsgd-tc, the unselected word lines(WLunselected) are raised to Vread-tc, and the selected word line (WLn)is raised to Vcgr-tc, e.g., Vra, Vrb, or Vrc, for a read operation, orto a verify level, e.g., Vva, Vvb, or Vvc, for a verify operation. Inthis case, the sense amplifier holds the bit line voltage constantregardless of what the NAND sting is doing, so the sense amplifiermeasures the current flowing with the bit line “clamped” to thatvoltage. At some point after time t1 and prior to time t3 (as determinedby the particular implementation), the sense amplifier will determinewhether the capacitor in the sense amplifier has dissipated a sufficientamount. At time t3, the depicted waveforms will be lowered to Vss (oranother value for standby or recovery). Note that in other embodiments,the timing of some of the waveforms can be changed.

FIG. 15 b depicts the timing diagram of FIG. 15 a in which differenttemperature-compensated voltages are applied to the selected word linebased on word line position. As discussed in connection with FIG. 14, inone approach, a temperature compensation which is higher in magnitude(e.g., more negative) is can be applied to the selected word line whenthe position of the word line is closer to the drain than to the source.This is exemplified by the timing diagram of FIG. 15 b, in which thetemperature-compensated voltage which is applied to a selected word linewhich is closer to the source, e.g., WL0, is shown by a dashed line,while the temperature-compensated voltage which is applied to theselected word line which is closer to the drain, e.g., WL31, is shown bya solid line. A temperature-compensated voltage which is applied to theselected world line when it is intermediate to the source and drain isintermediate to the temperature-compensated voltages which are appliedto the selected word line when it is at the source or drain side, inproportion to the distance from the source or drain, for instance. Aword line position dependency can be provided for the voltages appliedto one or more of the select gates and the unselected word lines aswell. FIGS. 16-18 can be modified analogously to provide a word lineposition dependency.

FIG. 16 is a timing diagram that explains the behavior of certainwaveforms during read/verify operations, where temperature-compensatedvoltages are applied to all unselected word lines, except the word linesdirectly neighboring a selected word line, and to both select gates.Waveforms SGD, SGS (option 1) and SGS (option 2) are the same as in FIG.15 a. The Selected BL and Source waveforms, not depicted, are also thesame as in FIG. 15 a. Note that the waveform labeled WL0 through WLn−2represents the temperature-compensated read voltage which is applied tothe word lines between and including the first word line, WL0, and aword line, WLn−2, which is next to a source-side neighbor word line,WLn−1, of the selected word line, WLn. The waveform labeled WLn+2through WL31 represents the temperature-compensated read voltage whichis applied to the word lines between and including the word line, WLn+2,which is next to a drain-side neighbor word line, WLn+1, of the selectedword line, WLn, and WL31, which directly neighbors the drain side selectgate, assuming there are thirty-two storage elements on a NAND string;however, a different number may be used. For these unselected wordlines, temperature compensation is applied as discussed. Similarly, forthe selected word line, WLn, a temperature-compensated control gate readvoltage, Vcgr-tc, is applied.

For either or both of the word lines WLn−1 and WLn+1 which are directneighbors of the selected word line, the applied read voltage is eithernot temperature compensated, or is temperature-compensated by a reducedamount, e.g., a substantially reduced amount, compared to thetemperature-compensation applied to the other unselected word lines. Anoptimal compensation for a specific memory device can be determined bytesting. It can be desirable to treat the word lines WLn−1 and WLn+1differently than other word lines due to parasitic capacitance pathwaysbetween the selected storage element and the neighboring storageelements. That is, a temperature compensation voltage which is appliedto the Vread of the neighboring storage elements can be capacitivelycoupled to the selected storage element, thereby shifting its thresholdvoltage higher. This can be problematic particularly for theabove-mentioned read/verify techniques which employ multiple read levelsfor each programming state. Further, it may be desirable to treat wordlines WLn−1 and WLn+1 differently from one another in regard totemperature compensation.

FIG. 17 is a timing diagram that explains the behavior of certainwaveforms during read/verify operations, where the selected word linedirectly neighbors a source side select gate. Waveforms SGD, SGS (option1) and SGS (option 2) are the same as in FIG. 15 a. The Selected BL andSource waveforms, not depicted, are also the same as in FIG. 15 a. Here,the selected word line, WL0, is a direct neighbor of the source sideselect gate. As mentioned, for some read/verify techniques, it may bedesirable to not use temperature compensation for the read voltage whichis applied to the transistors which neighbor the selected storageelement. These neighboring transistors include the source side selectgate on one side and the storage element associated with WL1 on theother side. Thus, in one possible approach, the voltages applied are nottemperature compensated, or are temperature compensated by a lesseramount than the compensation applied to the other unselected word lines,and the other select gate, the drain side select gate, which is not adirect neighbor of the selected storage element. In particular, Vsgs canbe applied to SGS, Vread-tc can be applied to WL0 and WL2 through WL31,Vread can be applied to WL1, and Vsgd-tc can be applied to SGD.

FIG. 18 is a timing diagram that explains the behavior of certainwaveforms during read/verify operations, where the selected word linedirectly neighbors a drain side select gate. Waveforms SGD, SGS (option1) and SGS (option 2) are the same as in FIG. 15 a. The Selected BL andSource waveforms, not depicted, are also the same as in FIG. 15 a. Here,the selected word line, WL31, is a direct neighbor of the drain sideselect gate. As mentioned, for some read/verify techniques, it may bedesirable to not use temperature compensation for the read voltage whichis applied to the transistors which neighbor the selected storageelement. These neighboring transistors include the drain side selectgate on one side and WL30 on the other side. Thus, in one possibleapproach, the voltages applied are not temperature compensated, or aretemperature compensated by a lesser amount than the compensation appliedto the other unselected word lines, and the other select gate, thesource side select gate, which is not a direct neighbor of the selectedstorage element. In particular, Vsgs-tc can be applied to SGS, Vread-tccan be applied to WL0 through WL39, and WL31, Vread can be applied toWL30, and Vsgd can be applied to SGD. Thus, in the approaches of FIG. 17and FIG. 18, the voltage applied to one or both select gates can be setto different levels, e.g., a temperature-uncompensated or compensatedlevel, based on whether the neighboring storage element is selected orunselected, respectively.

FIG. 19 is a flow chart describing one embodiment of a method forprogramming non-volatile memory. In one implementation, storage elementsare erased (in blocks or other units) prior to programming. In step1900, a “data load” command is issued by the controller and inputreceived by control circuitry 310. In step 1905, address datadesignating the page address is input to decoder 314 from the controlleror host. In step 1910, a page of program data for the addressed page isinput to a data buffer for programming. That data is latched in theappropriate set of latches. In step 1915, a “program” command is issuedby the controller to state machine 312.

Triggered by the “program” command, the data latched in step 1910 willbe programmed into the selected storage elements controlled by statemachine 312 using the stepped pulses 1310, 1320, 1330, 1340, 1350, . . .of FIG. 13 applied to the appropriate word line. In step 1920, theprogram voltage, Vpgm, is initialized to the starting pulse (e.g., 12 Vor other value) and a program counter PC maintained by state machine 312is initialized at 0. In step 1925, the first Vpgm pulse is applied tothe selected word line to begin programming storage elements associatedwith the selected word line. If logic “0” is stored in a particular datalatch indicating that the corresponding storage element should beprogrammed, then the corresponding bit line is grounded. On the otherhand, if logic “1” is stored in the particular latch indicating that thecorresponding storage element should remain in its current data state,then the corresponding bit line is connected to Vdd to inhibitprogramming.

In step 1930, the states of the selected storage elements are verifiedusing appropriate temperature-compensated voltages and voltages whichare not temperature-compensated, or which are temperature-compensated bya reduced amount, as discussed. If it is detected that the targetthreshold voltage of a selected storage element has reached theappropriate level, then the data stored in the corresponding data latchis changed to a logic “1.” If it is detected that the threshold voltagehas not reached the appropriate level, the data stored in thecorresponding data latch is not changed. In this manner, a bit linehaving a logic “1” stored in its corresponding data latch does not needto be programmed. When all of the data latches are storing logic “1,”the state machine (via the wired-OR type mechanism described above)knows that all selected storage elements have been programmed. In step1935, it is checked whether all of the data latches are storing logic“1.” If so, the programming process is complete and successful becauseall selected storage elements were programmed and verified. A status of“PASS” is reported in step 1940. In one embodiment, the verification ofstep 1930 includes providing temperature-compensated voltages to one ormore unselected word lines, and to one or more select gates, asdiscussed previously in connection with FIGS. 15-18.

If, in step 1935, it is determined that not all of the data latches arestoring logic “1,” then the programming process continues. In step 1945,the program counter PC is checked against a program limit value PCmax.One example of a program limit value is twenty; however, other numberscan also be used. If the program counter PC is not less than PCmax, thenthe program process has failed and a status of “FAIL” is reported instep 1950. If the program counter PC is less than PCmax, then the Vpgmlevel is increased by the step size and the program counter PC isincremented in step 1955. After step 1955, the process loops back tostep 1925 to apply the next Vpgm pulse.

The foregoing detailed description of the invention has been presentedfor purposes of illustration and description. It is not intended to beexhaustive or to limit the invention to the precise form disclosed. Manymodifications and variations are possible in light of the aboveteaching. The described embodiments were chosen in order to best explainthe principles of the invention and its practical application, tothereby enable others skilled in the art to best utilize the inventionin various embodiments and with various modifications as are suited tothe particular use contemplated. It is intended that the scope of theinvention be defined by the claims appended hereto.

1. A method for operating non-volatile storage, comprising: applying avoltage to a selected word line; and during the applying, determining aprogramming condition of at least one non-volatile storage element whichis associated with the selected word line, the at least one non-volatilestorage element is provided in a set of non-volatile storage elements,and the voltage is temperature-compensated according to a relativeposition of the selected word line among a plurality of word lines whichare associated with the set of non-volatile storage elements.
 2. Themethod of claim 1, wherein: a greater magnitude of temperaturecompensation is used when the selected word line is closer to a drainthan to a source of a block which includes the plurality of word lines.3. The method of claim 1, further comprising: applying a series ofdifferent voltages to the selected word line to determine theprogramming condition of the at least one non-volatile storage element,each voltage in the series is temperature-compensated according to therelative position of the selected word line among the plurality of wordlines.
 4. The method of claim 1, wherein: the voltage comprises a readvoltage for reading the programming condition of the at least onenon-volatile storage element after the at least one non-volatile storageelement has been programmed.
 5. The method of claim 1, wherein: thevoltage comprises a verify voltage for determining whether the at leastone non-volatile storage element has reached a desired programmingcondition.
 6. The method of claim 1, wherein: the at least onenon-volatile storage element is provided in a NAND string.
 7. A methodfor operating non-volatile storage, comprising: applying a voltage to atleast one non-volatile storage element in a set of non-volatile storageelement; and during the applying, determining a programming condition ofthe at least one non-volatile storage element, the voltage istemperature-compensated according to a position of the at least onenon-volatile storage element in the set.
 8. The method of claim 7,wherein: the non-volatile storage elements in the set are provided in aNAND string.
 9. The method of claim 8, wherein: a greater magnitude oftemperature compensation is used when the at least one non-volatilestorage element is closer to a drain side than to a source side of theNAND string.
 10. The method of claim 7, wherein: the determining theprogramming condition of the at least one non-volatile storage elementcomprises determining whether a threshold voltage of the at least onenon-volatile storage element exceeds a specified threshold voltage. 11.A non-volatile storage system, comprising: a set of non-volatile storageelements; and one or more circuits in communication with the set ofnon-volatile storage elements via a plurality of word lines, the one ormore circuits apply a voltage to a selected word line to determine aprogramming condition of at least one non-volatile storage element inthe set of non-volatile storage elements, the voltage istemperature-compensated according to a relative position of the selectedword line among the plurality of word lines.
 12. The non-volatilestorage system of claim 11, wherein: a greater magnitude of temperaturecompensation is used when the selected word line is closer to a drainthan to a source of a block which includes the plurality of word lines.13. The non-volatile storage system of claim 11, wherein: the one ormore circuits apply a series of different voltages to the selected wordline to determine the programming condition of the at least onenon-volatile storage element, each voltage in the series istemperature-compensated according to the relative position of theselected word line among the plurality of word lines.
 14. Thenon-volatile storage system of claim 11, wherein: the voltage comprisesa read voltage for reading the programming condition of the at least onenon-volatile storage element after the at least one non-volatile storageelement has been programmed.
 15. The non-volatile storage system ofclaim 11, wherein: the voltage comprises a verify voltage fordetermining whether the at least one non-volatile storage element hasreached a desired programming condition.
 16. The non-volatile storagesystem of claim 11, wherein: the at least one non-volatile storageelement is provided in a NAND string.
 17. A non-volatile storage system,comprising: a set of non-volatile storage elements; and one or morecircuits in communication with the set of non-volatile storage elementsvia a plurality of word lines, the one or more circuits: (a) apply avoltage to at least one non-volatile storage element in the set, and (b)while applying the voltage, determine a programming condition of the atleast one non-volatile storage element, the voltage istemperature-compensated according to a position of the at least onenon-volatile storage element in the set.
 18. The non-volatile storagesystem of claim 17, wherein: the non-volatile storage elements in theset are provided in a NAND string.
 19. The non-volatile storage systemof claim 18, wherein: a greater magnitude of temperature compensation isused when the at least one non-volatile storage element is closer to adrain side than to a source side of the NAND string.
 20. Thenon-volatile storage system of claim 17, wherein: the one or morecircuits determine the programming condition of the at least onenon-volatile storage element by determining whether a threshold voltageof the at least one non-volatile storage element exceeds a specifiedthreshold voltage.